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Aehr Test Systems % des Leerverkaufs (short % of float)

Was ist das % des Leerverkaufs (short % of float) von Aehr Test Systems?

% des Leerverkaufs (short % of float) von Aehr Test Systems ist 13.67%

Was ist die Definition von % des Leerverkaufs (short % of float)?



% des Leerverkaufs (Short % of Float) ist die Menge der Aktien, die im Leerverkauf verkauft worden sind, die im Vergleich zum Float in Prozent ausgedrückt wird.

Short percentage of float, or short interest ratio, is calculated by taking the total amount of shares shorted and dividing it by the total amount of shares available for trade. It is an indirect metric of investor sentiment. When short percentage of float is high, above 40%, it implies company investors hope shares will decline in value. The percentage is used by both fundamental and technical traders to identify trends. The short percentage of float can also be calculated for entire exchanges to determine the sentiment of the market as a whole. If it is high of around five or greater for an exchange, this can be taken as a bearish signal, and vice versa.

% des Leerverkaufs (short % of float) von Unternehmen in Technology Sektor auf NASDAQ im Vergleich zu Aehr Test Systems

Was macht Aehr Test Systems?

headquartered in fremont, california, aehr test systems is a worldwide supplier of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. aehr test has developed and introduced several innovative products, including the abts, foxtm and max systems and the diepak® carrier. the abts system is aehr test’s newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. the fox system is a full wafer contact test and burn-in system. the max system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. the diepak carrier is a reusable, temporary package that enables ic manufacturers to perform cost-effective final test and burn-in of bare die.

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